- CoreExpress
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Computer form factors Name PCB size (mm) WTX 356 × 425 AT 350 × 305 Baby-AT 330 × 216 BTX 325 × 266 ATX 305 × 244 EATX (Extended) 305 × 330 LPX 330 × 229 microBTX 264 × 267 NLX 254 × 228 Ultra ATX 244 × 367 microATX 244 × 244 DTX 244 × 203 FlexATX 229 × 191 Mini-DTX 203 × 170 EBX 203 × 146 microATX (min.) 171 × 171 Mini-ITX 170 × 170 EPIC (Express) 165 × 115 ESM 149 × 71 Nano-ITX 120 × 120 COM Express 125 × 95 ESMexpress 125 × 95 ETX/XTX 114 × 95 Pico-ITX 100 × 72 PC/104 (-Plus) 96 × 90 ESMini 95 × 55 Qseven 70 × 70 mobile-ITX 60 × 60 CoreExpress 58 × 65 CoreExpress modules are complete computer-on-module (COM) highly integrated, small and compact PCs that can be used in an embedded computer board design, much like an integrated circuit component. COMs integrate CPU, memory, graphics, and BIOS, and common IO interfaces. The interfaces are legacy-free, using only digital buses such as PCI Express, SATA, Ethernet, USB, and HD audio (Intel High Definition Audio). All signals are accessible on a high-density, high-speed, 220 pin connector. Although currently available implementations use Intel processors, the specification is open for different CPU CoM solutions.
CoreExpress modules are mounted on a custom carrier board, containing the peripherals required for the specific application. In this way, small but highly specialized computer systems can be built.
The CoreExpress form factor was originally developed by LiPPERT Embedded Computers and standardized by SFF-SIG in 2010[1].
Contents
Size & Mechanics
The specification defines a board size of 58 mm × 65 mm, slightly less than a credit card.
The module can be embedded into a heat spreader, which takes care of removing the dissipated heat. Suitably sealed, the heat spreader also doubles as EMC protection.
Specification
The specification is hosted by the Small Form Factors Special Interest Group (SFF-SIG) and is available for download[2] on their website. The current revision 2.1 was released on February 23, 2010.
See also
- Embedded System Module
- Computer-on-module
- Computer form factor
- Embedded system
References
- ^ "SFF-SIG Adopts CoreExpress Specification to Strengthen PCIe 2.0-Ready COM Portfolio". http://www.sff-sig.org/pr/pr0310_core.pdf. Retrieved 2010-07-21.
- ^ "CoreExpress Specification". http://www.sff-sig.org/coreexpress_spec_v21.pdf. Retrieved 2010-07-21.
External links
Categories:- Motherboard form factors
- Computer hardware standards
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