Missouri University of Science and Technology Electromagnetic Compatibility Consortium

The Missouri S&T EMC (Electromagnetic Compatibility) Consortium is a broad partnership of digital electronics companies committed to funding electromagnetic compatibility research.

Research Areas

Research is conducted in areas such as

• Printed Circuit Board (PCB) level electromagnetic interference (EMI)
• Enclosure Design for EMI
• Full-vehicle EMI from automotive electronics
• Chip-level EMI investigation
• DC power bus design and modeling
• Signal Routing through connectors
• Shielding enclosure design
• Differential signaling
• Low-cost filtering design at I/O connectors
• PCB layout strategies for low-cost boards
• Electrostatic Discharge Susceptibility of Computer Peripherals
• Repeatable Electrostatic Discharge Tests
• Integrated circuit packaging and layout
• Development of Electromagnetic Compatibility advisors for PCB layout

Consortium Members

• Altera Corporation
• Apple Computer Corporation
• Cisco Systems
• Freescale Semiconductor
• Hitachi, Ltd
• Huawei
• IBM Corporation
• Intel Corporation
• John Deere
• Laird Technologies
• LG Corporation
• NEC Corporation
• NCR Corporation
• Research in Motion (RIM)
• Samsung
• Sony Corporation
• Texas Instruments
• Zuken

In addition to private and public companies, other universities and research laboratories may become members as well.

Members share the benefits of all research done by the consortium, and also gain from the reduced cost of pooling research efforts. Companies as well as students also have an advantage from close collaboration that allows consortium members to identify desirable students for future employment.

External links

• Missouri S&T EMC Consortium Homepage
• Consortium Research Projects
• Missouri S&T homepage (www.mst.edu)